I-10 Layer ENIG FR4 Blind Vias PCB
Mayelana Nezimpumputhe Zingcwatshwe Nge-PCB
Impumputhe Nge:eyenza ukuxhumana kanye nokuqhutshwa phakathi kwezingqimba zangaphakathi nezingaphandle
Wangcwatshwa Nge:ekwazi ukuxhuma futhi iqondise phakathi kwezingqimba zangaphakathi I-Blind Vias ngokuvamile iyizimbobo ezincane ezinobubanzi obungu-0.05mm~0.15mm.Kukhona ukwakhiwa kwemigodi ye-laser, imbobo egxilile ye-plasma kanye nokwakhiwa kwembobo eyenziwe ngezithombe, futhi ukwakhiwa kwemigodi ye-laser kuvame ukusetshenziswa.
I-HDI:High-density interconnection, non-mechanical drilling, micro-blind hole ring engaphansi kuka-6mil, izingqimba zangaphakathi nangaphandle zomugqa wezintambo ububanzi/igebe lomugqa lingaphansi kuka-4mil, ububanzi bephedi abungaphezu kuka-0.35mm bubizwa ngemodi yokukhiqiza ibhodi le-HDI. .
Izimpumputhe Vias
I-Blind Vias isetshenziselwa ukuxhuma ungqimba olulodwa lwangaphandle okungenani isendlalelo esisodwa sangaphakathi.Ungqimba ngalunye lwembobo eyimpumputhe ludinga ukukhiqiza ifayela lokubhola elihlukile.Isilinganiso sokujula kwembobo nendawo yokuvula (i-aspect ratio/thickness-diameter ratio) kufanele ibe ngaphansi noma ilingane no-1. Imbobo kakhiye inquma ukujula kwembobo, okungukuthi, ibanga eliphakeme phakathi kongqimba olungaphandle kanye nongqimba lwangaphakathi.