4 Ungqimba ENIG FR4 Half Hole PCB

Ukubhoboza -- I-Chemical Copper -- I-Full Plate Copper -- Ukudluliswa Kwesithombe -- Graphics Electroplating -- Defilm -- Etching -- Stretch Soldering -- I-Half Hole Surface Coating (Kubunjwe Ngesikhathi Esifanayo Nephrofayela).

Imbobo eyingxenye yensimbi inqunywa phakathi ngemva kokwakhiwa kwembobo eyindilinga.Kulula ukuvela isenzakalo sezinsalela zocingo lwethusi kanye nesikhumba sethusi esiphendukayo emgodini oyingxenye, okuthinta umsebenzi wembobo yesigamu futhi kuholela ekwehleni kokusebenza komkhiqizo kanye nesivuno.Ukuze unqobe lezi ziphambeko ezingenhla, kuzokwenziwa ngokulandela lezi zinyathelo ezilandelayo ze-PCB ene-metallized semi-orifice:

1. Kucutshungulwa ummese oyingxenye yembobo ephindwe kabili yohlobo lwe-V.

2. Ku-drill yesibili, imbobo yomhlahlandlela yengezwe emaphethelweni omgodi, isikhumba sethusi sisuswa kusengaphambili, futhi i-burr iyancipha.Ama-grooves asetshenziselwa ukubhola ukuze kuthuthukiswe isivinini sokuwa.

3. I-Copper Plating ku-substrate, ukuze ungqimba lwethusi lubekwe odongeni lwembobo yembobo eyindilinga emaphethelweni epuleti.

4. Isifunda sangaphandle senziwe ngefilimu yokucindezela, ukuchayeka kanye nokuthuthukiswa kwe-substrate ngokushintshana, bese i-substrate ihlanganiswe ngethusi nethini kabili, ukuze ungqimba lwethusi odongeni lwembobo yembobo eyindilinga emaphethelweni embobo. ipuleti liqina futhi ungqimba lwethusi lumbozwe ungqimba lwethini ngomphumela wokulwa nokugqwala;

5. Ingxenye yembobo eyakha ipuleti enqenqemeni Imbobo eyindilinga isikwe phakathi ukuze kwakhiwe uhhafu wembobo;

6. Ukukhipha ifilimu kuzosusa ifilimu ephikisana ne-plating ecindezelwe inqubo yokucindezela ifilimu;

7. Gcoba i-substrate, bese ukhipha okokugcizelelwa kwethusi obala ongqimbeni olungaphandle lwe-substrate ngemva kokukhipha ifilimu;Ukuxebuka kukathayela I-substrate iyahlutshiwe ukuze ithini likhishwe odongeni olunezimbobo ezincane kanye nongqimba lwethusi engxenyeni engaphansi. udonga olunezimbobo luyadalulwa.

8. Ngemva kokubumba, sebenzisa itheyiphu ebomvu ukuze unamathisele amapuleti eyunithi ndawonye, ​​naphezu komugqa wokukhipha i-alkali ukuze ususe ama-burrs.

9. Ngemuva kokufakwa kwethusi kwesibili kanye nokufakwa kwe-tin ku-substrate, imbobo eyisiyingi emaphethelweni epuleti inqunywa phakathi ukuze yakhe imbobo eyingxenye.Ngoba ungqimba lwethusi lodonga lwembobo lumbozwe ungqimba lwethini, futhi ungqimba lwethusi lodonga lwembobo luxhunywe ngokuphelele nongqimba lwethusi lwengqimba yangaphandle ye-substrate, futhi amandla okubopha makhulu, ungqimba lwethusi emgodini. udonga lungagwenywa ngokuphumelelayo lapho usika, njengokudonsa noma isenzakalo se-copper warping;

10. Ngemuva kokuphothulwa kokwakhiwa kwe-semi-hole bese ususa ifilimu, bese u-etch, i-copper surface oxidation ngeke yenzeke, gwema ngokuphumelelayo ukuvela kwezinsalela zethusi ngisho nesenzakalo esifushane sesifunda, sithuthukise isivuno se-PCB ye-metallized semi-hole. .