4 Ungqimba ENIG FR4+R04350 Mixed Lamination PCB
FR4+Rogers Ukuxuba Lamination PCB Ubunzima bokukhiqiza
Enye yezinselelo ezinkulu ezinhlelweni ze-RF/microwave yindlela yokuqinisekisa ukuthi ukubekezelelana kwangempela kungaphakathi kokubekezelelwa kwedizayini, ukuze kuzuzwe imvamisa yokusebenza oyifunayo.Enye yezinselelo ezinkulu ekwakhiweni kwe-lamination yezakhiwo zokucindezela okuxubile iwukuba nogqinsi olufanayo phakathi kwamaphaneli ahlukene noma phakathi kwezingcezu ezihlukene.Ngenxa yokuba khona kwezinhlobonhlobo zezinhlobo ze-substrate, kunezinhlobo zezinhlobo zamashidi e-semi-cured.
I-Rogers ihlukile ku-PCB epoxy resin yendabuko.Ayikho i-glass fiber phakathi futhi iyi-ceramic based high frequency material.Kumaza omjikelezo angaphezu kuka-500MHz, ububanzi bezinto ezitholakala kunjiniyela wokuklama buncipha kakhulu.Izinto ze-Rogers RO4350B zingenziwa kalula amasekhethi omklamo wobunjiniyela be-RF, njengokumatanisa kwenethiwekhi, isilawuli sokuvinjelwa komugqa wokudlulisela, njll. Ngenxa yokulahlekelwa kwayo okuphansi kwe-dielectric, i-R04350B inenzuzo ngaphezu kwezinto ezivamile zesekethe kuzicelo zefrikhwensi ephezulu.Ukuguquguquka kwe-dielectric kokuguquguquka kwezinga lokushisa cishe kuphansi kwento efanayo.Imvume futhi izinze ngokuphawulekayo ku-3.48 phezu kwebanga elibanzi lefrikhwensi.3.66.Izincomo ze-Lopra copper foil design ukunciphisa ukulahlekelwa kokufaka.Lokhu kwenza okokusebenza kulungele ukusetshenziswa kwe-broadband.
Izinzuzo Zokuxuba I-Lamination High Frequency PCB
1. I-PCB ye-High-frequency inokuminyana okuphezulu nesignali ethuthukisiwe.Ihlinzeka ngebanga lemvamisa ukusuka ku-500MHz kuye ku-2GHz, elungele imiklamo enesivinini esikhulu.
2. Ukusetshenziswa kwesendlalelo esingaphansi kuthuthukisa nakakhulu ikhwalithi yesiginali futhi kunciphisa igagasi likagesi.
3.Yehlisa i-impedance yesifunda futhi unikeze umphumela wokuvikela.
4. Ngokunciphisa ibanga phakathi kwendiza nongqimba lomzila, i-crosstalk ingagwenywa
Umbukiso Wemboni
PCB Manufacturing Base
I-Admin Receptionist
Igumbi Lomhlangano
