6 Layer ENIG Via-In-Pad PCB
Izinzuzo Ze-Plug Hole
1. Imbobo yepulaki ingavimbela i-PCB ngethayela lokunamathisela legagasi ukusuka embobeni ngokusebenzisa ingxenye ebangelwa ukujikeleza okufushane;Okusho ukuthi, ngaphakathi kobubanzi bendawo yokuklama i-wave soldering (ngokuvamile indawo yokushisela ingu-5mm noma ngaphezulu) ayikho imbobo noma imbobo yokwenza ipulaki yokwelapha imbobo.
2. Imbobo yepulaki ivikela kumasekhethi amafushane okungenzeka abangelwa amadivayisi asondelene njenge-BGA.Lesi yisizathu somgodi ongaphansi kwe-BGA ukugcina imbobo ohlelweni lokuklama.Ngenxa yokuthi ayikho imbobo yepulaki, lokhu kuyindaba yokujikeleza okufushane.
3. Gwema izinsalela ze-flux emgodini wokuhambisa;
4. Ngemuva kokuthi ukunyuswa okungaphezulu kanye nokuhlanganiswa kwengxenye yefekthri ye-elekthronikhi sekuqediwe, i-PCB izodonswa nge-vacuum kanye nokucindezela okungekuhle emshinini wokuhlola ngaphambi kokuqedwa:
5. Vimbela usolder unamathisele emgodini obangelwa Welding virtual, kuthinte ukufakwa;Leli phuzu libonakala kakhulu kuphedi yokukhipha ukushisa enezimbobo.
6. Ukuvimbela ukuvela kwe-wave soldering tin ubuhlalu, okuholela ekujikelezeni okufushane.
7. Imbobo yepulaki izoba usizo kunqubo ye-SMT.