8 Ungqimba ENIG FR4 Nge-In-Pad PCB
Inqubo yokuxhuma i-Resin
Incazelo
Inqubo yokuxhuma i-resin ibhekisela ekusetshenzisweni kwe-resin ukuxhuma izimbobo ezigqitshiwe kungqimba lwangaphakathi, bese ucindezela, osetshenziswa kakhulu ebhodini le-high-frequency kanye nebhodi le-HDI;ihlukaniswe ngokuphrinta kwesikrini kwendabuko I-Resin Plugging kanye ne-vacuum resin plugging.Ngokuvamile, inqubo yokukhiqiza yomkhiqizo iyimbobo yepulaki ye-resin yendabuko yokuphrinta isikrini, okubuye kube inqubo evame kakhulu embonini.
Inqubo
Pre process — drilling resin hole — electroplating — resin plug hole — ceramic grinding plate — drilling through hole — electroplating — post process
Izidingo ze-Electroplating
Ngokwezidingo zethusi ukujiya, electroplating.Ngemuva kwe-electroplating, imbobo yepulaki ye-resin yasikwa ukuze kuqinisekiswe ukuthi i-concavity.
Inqubo yokuxhuma i-Vacuum Resin
Incazelo
Umshini womgodi wokuphrinta wesikrini se-vacuum uyisisetshenziswa esikhethekile semboni ye-PCB, elungele imbobo yepulaki ye-PCB yembobo eyimpumputhe, imbobo encane yepulaki ye-resin yembobo, kanye nembobo encane yepulaki yepuleti le-resin.Ukuze kuqinisekiswe ukuthi alikho ibhamuza ekuphrinteni kwembobo yepulaki ye-resin, okokusebenza kuklanywe futhi kwenziwa nge-vacuum ephezulu, futhi inani eliphelele le-vacuum le-vacuum lingaphansi kuka-50pA.Ngesikhathi esifanayo, isistimu ye-vacuum kanye nomshini wokunyathelisa isikrini kwakhiwa nge-anti vibration namandla aphezulu esakhiweni, ukuze okokusebenza kusebenze ngokuzinza.
Umehluko