8 Ungqimba ENIG FR4 Half Hole PCB
I-Half Hole Technology
Ngemuva kokuthi i-PCB yenziwe emgodini oyingxenye, ungqimba lwethini lusethwe emaphethelweni embobo nge-electroplating.Ungqimba lukathayela lusetshenziswa njengesendlalelo esivikelayo ukuze kuthuthukiswe ukumelana nezinyembezi futhi kuvimbele ngokuphelele ungqimba lwethusi oluwa odongeni lwembobo.Ngakho-ke, isizukulwane sokungcola ekukhiqizeni ibhodi lesifunda eliphrintiwe liyancishiswa, futhi umthwalo wokuhlanza nawo uyancipha, ukuze kuthuthukiswe ikhwalithi ye-PCB eqediwe.
Ngemuva kokuthi ukukhiqizwa kwe-PCB ye-half-hole evamile sekuqediwe, kuzoba nama-chips ethusi ezinhlangothini zombili ze-half-hole, futhi ama-chips ethusi azobandakanyeka ohlangothini lwangaphakathi lwe-half-hole.Imbobo enguhhafu isetshenziswa njenge-PCB yengane, indima yembobo enguhhafu isenqubo ye-PCBA, izothatha ingxenye yengane ye-PCB, ngokunikeza uhhafu wembobo yokugcwalisa ithini ukwenza uhhafu wepuleti elikhulu elishiselwe ebhodini elikhulu. , kanye nengxenye yembobo enezinsimbi zethusi, izothinta ngqo ithini, ithinte ukushisela ngokuqinile kweshidi ebhodini lomama, futhi ithinte ukubukeka nokusetshenziswa komsebenzi wonke womshini.
Ubuso bembobo yesigamu bunikezwa ungqimba lwensimbi, futhi ukuphambana kwengxenye yembobo kanye nonqenqema lomzimba kunikezwa igebe ngokulandelana, futhi indawo yegebe iyindiza noma ingaphezulu legebe inhlanganisela yendiza kanye nobuso bobuso.Ngokwandisa igebe emikhawulweni yomibili yembobo ewuhhafu, ama-chips ethusi lapho kuhlangana khona imbobo ewuhhafu kanye nonqenqema lomzimba ayasuswa ukuze enze i-PCB ebushelelezi, kugwenywe ngokuphumelelayo ama-chips ethusi asele emgodini oyingxenye, okuqinisekisa ikhwalithi ye-PCB. I-PCB , kanye nekhwalithi yokushisela okuthembekile nokubukeka kwe-PCB ohlelweni lwe-PCBA, nokuqinisekisa ukusebenza kwawo wonke umshini ngemva komhlangano olandelayo.