Izinto | Amakhono okukhiqiza ngobuningi | Amakhono e-Prototyping |
| Izendlalelo | 1-20 | 1-28 |
| Izinto eziyisisekelo | FR-4, High-frequency |
| Usayizi omkhulu | 500mm×600mm | 580mm×800mm |
| Ukunemba kobukhulu | ±0.13mm | ±0.1mm |
| Ibanga lokuqina | 0.20-4.00mm | 0.20-6.00mm |
| Ukubekezelela ukushuba(THK≥0.8mm) | ±8% | ±8% |
| Ukubekezelela ukushuba(THK<0.8mm) | ±10% | ±10% |
| Ubukhulu be-Dielectric | 0.07-3.20mm | 0.07-5.00mm |
| Ububanzi bomugqa obuncane | 0.1mm | 0.075mm |
| Isikhala esincane | 0.1mm | 0.075mm |
| Ukujiya kwethusi kwangaphandle | 37-175 um | 35-280um |
| Ugqinsi lwethusi lwangaphakathi | 17-175 um | 17-280um |
| Imbobo yokubhoboza(Mechanical) | 0.15-6.35mm | 0.15-6.35mm |
| Imbobo eqediwe(Mechanical) | 0.10-6.30mm | 0.10-6.30mm |
| Ukubekezelela i-Diameter(Mechanical) | ±0.075mm | ±0.075mm |
| Ukubekezelela imbobo (Mechanical) | ±0.05mm | ±0.05mm |
| Ukubukeka kwesilinganiso | 10:01 | 13:01 |
| Uhlobo lwemaski ye-solder | I-LPI | I-LPI |
| Ububanzi obuncane bebhuloho lemaski ye-solder | 0.1mm | 0.08mm |
| Ubuncane bokuvunyelwa kwemaski ye-solder | 0.075mm | 0.05mm |
| Xhuma i-diameter yembobo | 0.25-0.50mm | 0.25-0.60mm |
| Ukubekezelelana kokulawulwa kwe-impedance | ±10% | ±10% |
| Ukuqedwa kobuso | HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger |
