Ukuthuthukiswa komkhuba webhodi lesifunda eliphrintiwe(PCB)

Ukuthuthukiswa komkhuba webhodi lesifunda eliphrintiwe(PCB)

Kusukela ekuqaleni kwekhulu lama-20, lapho ukushintshwa kwezingcingo kusunduza amabhodi wesekethe ukuthi aminyene, iibhodi lesifunda eliphrintiwe(PCB)imboni ibilokhu ifuna ukuminyana okuphezulu ukuze ihlangabezane nesidingo esinganelisi sezinto zikagesi ezincane, ezisheshayo nezishibhile.Ukuthambekela ekukhuleni kokuminyana akukanciphi nakancane, kodwa sekwenyukele ngisho nangesivinini.Ngokuthuthukiswa nokusheshisa kokusebenza kwesekethe edidiyelwe minyaka yonke, imboni ye-semiconductor iqondisa isiqondiso sokuthuthukiswa kobuchwepheshe be-PCB, ikhuthaza imakethe yebhodi lesifunda, futhi isheshisa nentuthuko yebhodi lesekethe eliphrintiwe (PCB).

Njengoba ukwanda kokuhlanganiswa kwesekethe okuhlanganisiwe kuholela ngokuqondile ekwandeni kwezimbobo zokufaka/zokuphumayo (I/O) (umthetho Wokuqasha), iphakheji nayo idinga ukukhuphula inombolo yokuxhumeka ukuze kufakwe i-chip entsha.Ngesikhathi esifanayo, osayizi bephakheji bahlale bezanywa ukuze babe bancane.Impumelelo yobuchwepheshe bokupakisha be-planar yenze kwaba nokwenzeka ukukhiqiza amaphakheji ahamba phambili angaphezu kuka-2000 namuhla, futhi leli nani lizokhula lifinyelele cishe ku-100000 phakathi neminyaka embalwa njengoba amakhompyutha a-Super-Super aguquka.I-Blue Gene ye-IBM, isibonelo, isiza ekuhlukaniseni inani elikhulu ledatha ye-DNA yofuzo.

I-PCB kufanele ihambisane nejika lokuminyana lephakheji futhi ivumelane nobuchwepheshe bakamuva bephakheji ehlangene.I-Direct chip bonding, noma ubuchwepheshe be-flip chip, inamathisela ama-chips ngokuqondile ebhodini lesekethe: ukudlula ukupakisha okuvamile ngokuphelele.Izinselelo ezinkulu ezilethwa ubuchwepheshe be-flip chip ezinkampanini zamabhodi esekethe zixazululwe kuphela engxenyeni encane futhi zikhawulelwe kwinani elincane lezicelo zezimboni.

Umhlinzeki we-PCB ekugcineni usefinyelele emikhawulweni eminingi yokusebenzisa izinqubo zesekethe evamile futhi kufanele aqhubeke nokuvela, njengoba kwakulindelekile, ngezinqubo ezincishisiwe zokucwilisa kanye nokumba imishini kube inselele.Imboni yesifunda eguquguqukayo, evame ukunganakwa futhi inganakwa, ihole inqubo entsha okungenani iminyaka eyishumi.Amasu okwenziwa kwe-conductor engezwayo manje angakhiqiza imigqa ephrintiwe yethusi ngaphansi kobubanzi be-ImilGSfzm, futhi ukubhola nge-laser kungakhiqiza ama-microholes angu-2mil (50Mm) noma ngaphansi.Ingxenye yalezi zinombolo ingafinyelelwa emigqeni yokuthuthukiswa kwezinqubo ezincane, futhi siyabona ukuthi lezi zinguquko zizothengiswa ngokushesha okukhulu.

Ezinye zalezi zindlela zibuye zisetshenziswe embonini yebhodi lesifunda eliqinile, kodwa ezinye zazo kunzima ukuzisebenzisa kulo mkhakha ngoba izinto ezifana ne-vacuum deposition azivamile ukusetshenziswa embonini yebhodi lesifunda eliqinile.Isabelo sokumba ngelaser singalindelwa ukuthi sikhule njengoba ukupakishwa kanye nezinto zikagesi zidinga amabhodi e-HDI engeziwe;Imboni yebhodi lesekethe eqinile izophinde ikhulise ukusetshenziswa kwe-vacuum coating ukwenza ukuminyana okuphezulu kwe-semi-addition conductor molding.

Ekugcineni, imultilayer PCB boardinqubo izoqhubeka nokuvela futhi isabelo semakethe senqubo ye-multilayer sizokhula.Umkhiqizi we-PCB uzophinde abone amabhodi wesifunda se-epoxy polymer system elahlekelwa imakethe yawo evuna ama-polymers angasetshenziswa kangcono kuma-laminates.Inqubo ingase isheshiswe uma izinqamuli zomlilo eziqukethe i-epoxy bezivinjelwe.Siyaqaphela futhi ukuthi amabhodi aguquguqukayo axazulule izinkinga eziningi zokuminyana okuphezulu, angashintshwa ukuze avumelane nezimo eziphakeme zokushisa ezingenawo umthofu wengxubevange, futhi izinto zokufaka eziguquguqukayo aziqukethe ugwadule nezinye izakhi ezisohlwini “lokubulala” lwezemvelo.

I-Huihe Circuits iyinkampani ekhiqiza i-PCB, esebenzisa izindlela zokukhiqiza ezingenawo amandla ukuze kuqinisekiswe ukuthi umkhiqizo we-PCB yekhasimende ngalinye ungathunyelwa ngesikhathi noma ngaphambi kwesikhathi esimisiwe.Sikhethe, futhi akudingeki ukhathazeke ngedethi yokulethwa.