Idizayini yembobo ku-PCB enesivinini esikhulu

Idizayini yembobo ku-PCB enesivinini esikhulu

Ekwakhiweni kwe-PCB enesivinini esikhulu, imbobo ebonakala ilula ivamise ukuletha umphumela omubi omkhulu ekwakhiweni kwesekethe.I- Through-hole (VIA) ingenye yezingxenye ezibaluleke kakhulu zeamabhodi we-PCB amaningi, futhi izindleko zokumba ngokuvamile zibalelwa ku-30% kuya ku-40% wezindleko zebhodi le-PCB.Kalula nje, yonke imbobo ku-PCB ingabizwa ngokuthi i- through-hole.

Ngokombono wokusebenza, izimbobo zingahlukaniswa zibe izinhlobo ezimbili: eyodwa isetshenziselwa uxhumano lukagesi phakathi kwezingqimba, enye isetshenziselwa ukulungiswa kwedivayisi noma ukubeka.Ngokwenqubo yezobuchwepheshe, lezi zimbobo zivame ukuhlukaniswa zibe izigaba ezintathu, okungukuthi i-blind via, cand through.

Ukuze kuncishiswe umthelela omubi obangelwa umphumela we-parasitic we-pore, izici ezilandelayo zingenziwa ngokusemandleni edizayini:

Uma kucatshangelwa izindleko nekhwalithi yesignali, imbobo yesayizi enengqondo iyakhethwa.Isibonelo, ngomklamo wemojula ye-PCB engu-6-10, kungcono ukhethe imbobo engu-10/20mil (imbobo/iphedi).Ebhodini likasayizi omncane elinomthamo omkhulu, ungaphinda uzame ukusebenzisa imbobo engu-8/18mil.Ngobuchwepheshe bamanje, kunzima ukusebenzisa ama-perforations amancane.Ukuze unikeze amandla noma imbobo yocingo lomhlabathi ingacatshangwa ukuthi isebenzise usayizi omkhulu, ukunciphisa i-impedance.

Kusukela kumafomula amabili okukhulunywe ngawo ngenhla, kungaphethwa ngokuthi ukusetshenziswa kwebhodi elincane le-PCB kunenzuzo ekwehliseni amapharamitha amabili e-parasitic embotsheni.

Izikhonkwane zikagesi nomhlabathi kufanele zibhojwe eduze.Okufushane umkhondo phakathi kwezikhonkwane nezimbobo, kungcono, njengoba kuzoholela ekwandeni kwe-inductance.Ngasikhathi sinye, ukunikezwa kwamandla kanye nemikhondo yomhlaba kufanele kube ukuqina ngangokunokwenzeka ukuze kuncishiswe i-impedance.

Izintambo zesignali ku-high-speed PCB boardakufanele uguqule izendlalelo ngangokunokwenzeka, okungukuthi, ukunciphisa izimbobo ezingadingekile.

Ezinye izimbobo ezisekelwe phansi zibekwe eduze kwezimbobo ezisesendlaleni sokushintshanisa isignali ukuze kunikezwe iluphu eseduze yesiginali.Ungakwazi ngisho nokubeka izimbobo eziningi ezingaphezuluIbhodi le-PCB.Yebo, udinga ukuguquguquka ekwakhiweni kwakho.Imodeli ye- through-hole okukhulunywe ngayo ngenhla inamaphedi kusendlalelo ngasinye.Kwesinye isikhathi, singanciphisa noma sisuse amaphedi kwezinye izendlalelo.

Ikakhulukazi esimweni sokuminyana kwe-pore enkulu kakhulu, kungase kuholele ekwakhiweni kwe-groove ephukile ekubekweni kwethusi kwesifunda sokuhlukanisa.Ukuze uxazulule le nkinga, ngaphezu kokuhambisa isikhundla se-pore, singase futhi sicabangele ukunciphisa usayizi we-solder pad ku-layer yethusi.

Isetshenziswa kanjani phezu kwezimbobo: Ngokuhlaziya okungenhla kwezici ze-parasite yezimbobo ezingaphezulu, singabona lokho kuPCB enesivinini esikhuluukuklama, ukusetshenziswa okungalungile okubonakala kulula kwezimbobo ezingaphezulu ngokuvamile kuzoletha imiphumela emibi kakhulu ekwakhiweni kwesifunda.