Kungani i-PCB yangokwezifiso ye-copper plating surface bubble?

Kungani i-PCB yangokwezifiso ye-copper plating surface bubble?

I-PCB yangokwezifisoi-surface bubbling ingenye yeziphambeko zekhwalithi ezivame kakhulu kunqubo yokukhiqiza ye-PCB.Ngenxa yobunkimbinkimbi benqubo yokukhiqiza ye-PCB kanye nokugcinwa kwenqubo, ikakhulukazi ekwelapheni okumanzi ngamakhemikhali, kunzima ukuvimbela amaphutha amabhamuza ebhodini.

Ukubhubhudla kuIbhodi le-PCBempeleni inkinga yokungaqini kahle kwesibopho ebhodini, futhi ngokwandisa, inkinga yekhwalithi yendawo ebhodini, ehlanganisa izici ezimbili:

1. Inkinga ye-PCB yokuhlanzeka kwendawo;

2. Ukuhwalala okuncane (noma amandla angaphezulu) kwe-PCB surface;zonke izinkinga zokugwedla ebhodini lesifunda zingafingqwa njengezizathu ezingenhla.Amandla okubopha phakathi kokugqoka ampofu noma aphansi kakhulu, ekukhiqizeni okulandelayo kanye nenqubo yokucubungula kanye nenqubo yokuhlanganisa kunzima ukumelana nenqubo yokukhiqiza nokucubungula okukhiqizwa ekucindezelweni kokugqoka, ukucindezeleka kwemishini kanye nokucindezeleka okushisayo, njalonjalo, okuholela ekuhlukeni okuhlukile. amadigri okuhlukaniswa phakathi kwesenzakalo sokumboza.

Ezinye izici ezidala ikhwalithi ephansi ephansi ekukhiqizeni nasekucutshungulweni kwe-PCB zifingqwa ngale ndlela elandelayo:

I-substrate ye-PCB yangokwezifiso - izinkinga zokwelashwa kwenqubo yepuleti eligqoke ithusi;Ikakhulukazi kwamanye ama-substrate azacile (ngokuvamile angaphansi kuka-0.8 mm), ngenxa yokuthi ukuqina kwe-substrate kumpofu, ukusetshenziswa okungalungile komshini wepuleti lebhulashi, kungase kuhluleke ukususa ngokuphumelelayo i-substrate ukuze kuvinjelwe i-oxidation engaphezulu ye-foil yethusi ngesikhathi sokukhiqiza. kanye nokucubungula kanye nongqimba olukhethekile lokucubungula, kuyilapho ungqimba luncane, ipuleti yebhulashi kulula ukuyisusa, kodwa ukucubungula kwamakhemikhali kunzima, Ngakho-ke, kubalulekile ukunaka ukulawula ekukhiqizeni nasekucubunguleni, ukuze kungabangela inkinga. ukukhihliza amagwebu okubangelwa amandla ampofu okubopha phakathi kwe-substrate ye-copper foil kanye nethusi lamakhemikhali;lapho ungqimba olungaphakathi oluncane luba mnyama, kuzophinde kube nokumnyama okungekuhle nokuba nsundu, umbala ongalingani, nokuba mnyama kwendawo.

PCB board surface inqubo machining (drilling, lamination, Milling, njll.) okubangelwa uwoyela noma olunye uketshezi uthuli ukungcoliswa kokwelashwa ebusweni impofu.

3. Ipuleti lebhulashi le-PCB elicwila ithusi alilungile: ukucindezela kwepuleti lokugaya ngaphambi kokucwila kwethusi kukhulu kakhulu, okuholela ekuguquguqukeni kwembobo, kanye ne-fillet ye-copper ye-foil emgodini ngisho nokuvuza kwezinto eziyisisekelo emgodini, okuzobangela ibhamuza. okwenzeka emgodini wenqubo yokucwilisa ithusi, i-plating, i-tin spraying kanye ne-welding;Ngisho noma ipuleti lebhulashi lingabangeli ukuvuza kwe-substrate, ipuleti lebhulashi eleqile lizokwandisa ukuhwalala kwembobo yethusi, ngakho-ke ngesikhathi sokugqwala kwe-micro-corrosion, i-foil yethusi kulula ukukhiqiza isenzakalo esibi kakhulu, lapho. kuyoba futhi ingozi ethile yekhwalithi;Ngakho-ke, kufanele kuqashelwe ukuqinisa ukulawulwa kwenqubo yepuleti lebhulashi, futhi imingcele yenqubo yepuleti lebhulashi ingalungiswa ibe ngcono kakhulu ngokuhlolwa kwe-wear mark kanye nokuhlolwa kwefilimu yamanzi.

4. Inkinga ye-PCB egeziwe: ngoba ukucubungula i-electroplating yethusi esindayo kufanele kudlule ukucutshungulwa kwamakhemikhali amaningi oketshezi lwamakhemikhali, zonke izinhlobo ze-acid-base i-solvent ye-non-polar organic efana nezidakamizwa, ukugeza ubuso bebhodi akuhlanzekile, ikakhulukazi ukulungiswa kwethusi esindayo ngaphezu kwalokho. ama-ejenti, hhayi kuphela angabangela ukungcoliswa kwesiphambano, futhi azobangela ibhodi ukuthi libhekane nokucubungula kwendawo nomphumela omubi wokwelapha, ukukhubazeka kokungalingani, kubangele amandla athile abophezelayo;ngakho-ke, ukunakekelwa kufanele kukhokhwe ekuqiniseni ukulawula ukugeza, ikakhulukazi kuhlanganise nokulawulwa kokugeleza kwamanzi okuhlanza, izinga lamanzi, isikhathi sokugeza, nesikhathi sokuconsa sezingxenye zamapuleti;ikakhulukazi ebusika, izinga lokushisa liphansi, umphumela wokugeza uzoncishiswa kakhulu, ukunakwa okwengeziwe kufanele kukhokhwe ekulawuleni ukugeza.