Izinkinga zokukhiqiza i-Multilayer PCB prototype

I-PCB enezingqimba eziningikwezokuxhumana, kwezokwelapha, ekulawuleni izimboni, ezokuphepha, imoto, amandla kagesi, zezindiza, ezempi, computer peripheral kanye nezinye izinkambu njengoba "amandla core", imisebenzi umkhiqizo iyanda, imigqa eminyene kakhulu, ngakho uma kuqhathaniswa, nobunzima ukukhiqiza. iyanda futhi.

Njengamanje, i-Abakhiqizi be-PCBIqoqo elingakhiqiza amabhodi esekethe e-multilayer e-China ngokuvamile livela emabhizinisini angaphandle, futhi ambalwa kuphela amabhizinisi asekhaya anamandla eqoqo.Ukukhiqizwa kwebhodi lesifunda elinezingqimba eziningi akudingi nje kuphela ubuchwepheshe obuphakeme kanye nokutshalwa kwezimali kwemishini, ukukhiqizwa okuhlangenwe nakho okungaphezulu kanye nabasebenzi bezobuchwepheshe, ngasikhathi sinye, thola isitifiketi sekhasimende lebhodi elinezingqimba eziningi, izinqubo eziqinile neziyisicefe, ngakho-ke, umkhawulo wokungena webhodi lesifunda elinezingqimba eziningi. iphakeme, ukugcwaliseka komjikelezo wokukhiqiza kwezimboni mude.Ikakhulukazi, ubunzima bokucubungula okuhlangatshezwane nabo ekukhiqizweni kwebhodi lesekethe ye-multilayer ikakhulukazi yizici ezine ezilandelayo.Ibhodi lesifunda le-Multilayer ekukhiqizeni nasekucubunguleni ubunzima obune.

1. Ubunzima ekwenzeni umugqa wangaphakathi

Kunezidingo ezikhethekile ezihlukahlukene zejubane eliphezulu, ithusi eliwugqinsi, imvamisa ephezulu kanye nenani eliphakeme le-Tg lemigqa yamabhodi amaningi.Izidingo zezintambo zangaphakathi kanye nokulawula usayizi wesithombe ziya ngokuya ngokuya phezulu.Isibonelo, ibhodi lokuthuthukiswa kwe-ARM linemigqa eminingi yesignali ye-impedance kungqimba yangaphakathi, ngakho-ke kunzima ukuqinisekisa ubuqotho be-impedance ekukhiqizeni komugqa wangaphakathi.

Kunemigqa yesignali eminingi ongqimbeni olungaphakathi, futhi ububanzi nesikhala semigqa cishe ku-4mil noma ngaphansi.Ukukhiqizwa okuncane kwepuleti le-multi-core kulula ukushwabana, futhi lezi zici zizokwandisa izindleko zokukhiqiza ungqimba lwangaphakathi.

2. Ubunzima engxoxweni phakathi kwezingqimba zangaphakathi

Ngezendlalelo ezengeziwe ze-multilayer plate, izidingo zesendlalelo sangaphakathi ziphezulu futhi ziphakeme.Ifilimu izokhula futhi inciphe ngaphansi kwethonya lokushisa elizungezile kanye nomswakama endaweni yokusebenzela, futhi ipuleti eliyinhloko lizoba nokunwebeka okufanayo futhi linciphe lapho likhiqizwa, okwenza kube nzima ukulawula ukunemba kwangaphakathi.

3. Ubunzima benqubo yokucindezela

I-superposition ye-multi-sheet core plate kanye ne-PP (ishidi eliqiniswe kancane) ijwayele ukuba nezinkinga ezifana nokwendlaleka, ama-slide nezinsalela zesigubhu lapho ucindezela.Ngenxa yenani elikhulu lezendlalelo, ukunwetshwa nokulawulwa kokuncipha kanye nesinxephezelo se-coefficient yosayizi akukwazi ukuqhubeka nokufana.I-insulation encane phakathi kwezingqimba izoholela kalula ekuhlulekeni kokuhlolwa kokwethembeka phakathi kwezingqimba.

4. Ubunzima ekukhiqizeni ukumba

I-multi-layer plate ithatha i-Tg ephezulu noma enye ipuleti ekhethekile, futhi ukuqina kokubhoboza kuhlukile ngezinto ezihlukahlukene, okwandisa ubunzima bokukhipha i-glue slag emgodini.Ukuminyana okuphezulu kwe-PCB enezingqimba eziningi inobuningi bembobo, ukusebenza kahle kokukhiqiza okuphansi, ukuphula ummese kulula, inethiwekhi ehlukene ngembobo, umkhawulo wembobo usondele kakhulu kuzoholela kumphumela we-CAF.

Ngakho-ke, ukuze kuqinisekiswe ukwethembeka okuphezulu komkhiqizo wokugcina, kuyadingeka ukuthi umenzi enze ukulawula okuhambisanayo enqubweni yokukhiqiza.