Ngenqubo ku-Multilayer PCB Fabrication

I-Vias ingenye yezingxenye ezibalulekile zeukwakhiwa kwe-PCB ye-multilayer, futhi izindleko zokumba ngokuvamile zibalelwa ku-30% kuya ku-40% wezindleko zeI-PCB prototype.I-via hole imbobo ebhojwe ku-copper clad laminate.Ithwala ukuqhutshwa phakathi kwezendlalelo futhi isetshenziselwa ukuxhumana kukagesi nokulungiswa kwamadivayisi.indandatho.

Kusukela kunqubo yokwenziwa kwe-PCB ye-multilayer, i-vias ihlukaniswe izigaba ezintathu, okungukuthi, izimbobo, izimbobo ezigqitshiwe kanye nezimbobo.Ekwenziweni nasekukhiqizeni i-PCB ye-multilayer, okuvamile ngezinqubo kufaka phakathi amafutha ekhava, kusetshenziswa uwoyela wepulaki, ngokuvula iwindi, imbobo yepulaki ye-resin, ukugcwaliswa kwembobo ye-electroplating, njll. Inqubo ngayinye inezici zayo.

1. Ngamafutha ekhava

“Amafutha” kawoyela wekhava asho amafutha e-solder mask, kanti uwoyela wekhava nge-hole uwukumboza indandatho yembobo ngoyinki we-solder mask.Inhloso yamafutha ekhava iwukugqumisa, ngakho-ke kuyadingeka ukuqinisekisa ukuthi isembozo sikayinki sendandatho yembobo sigcwele futhi siwugqinsi ngokwanele, ukuze ithini ngeke linamathele kupeshi kanye ne-DIP kamuva.Kufanele kuqashelwe lapha ukuthi uma ifayela liyi-PADS noma i-Protel, lapho lithunyelwa efekthri yokwenziwa kwe-PCB ye-multilayer ngokusebenzisa uwoyela wekhava, kufanele uhlole ngokucophelela ukuthi i-plug-in hole (PAD) isebenzisa, futhi uma kunjalo, umgodi wokuxhuma uzombozwa ngamafutha aluhlaza futhi awukwazi ukushiselwa.

2. Ngefasitela

Kukhona enye indlela yokubhekana “nowoyela wekhava” lapho kuvulwa i- via hole.I-via hole kanye ne-grommet akufanele imbozwe ngamafutha e-solder mask.Ukuvulwa kwembobo ngembobo kuzokwandisa indawo yokukhipha ukushisa, evumela ukuqeda ukushisa.Ngakho-ke, uma izidingo zokushisa ukushisa kwebhodi ziphakeme kakhulu, ukuvulwa kwe- via hole kungakhethwa.Ngaphezu kwalokho, uma udinga ukusebenzisa i-multimeter ukwenza umsebenzi wokulinganisa ku-vias ngesikhathi sokwenziwa kwe-PCB ye-multilayer, bese wenza i-vias ivuleke.Kodwa-ke, kunengozi yokuvula i- via hole - kulula ukubangela ukuba iphedi ibe mfushane ethini.

3. Ngamafutha epulaki

Ngowoyela wokuxhuma, okungukuthi, lapho i-PCB ye-multilayer icutshungulwa futhi ikhiqizwa, uyinki yemaski ye-solder ixhunywa kuqala embobeni ngeshidi le-aluminium, bese kuthi uwoyela we-mask we-solder uphrintwe ebhodini lonke, futhi zonke izimbobo. ngeke idlulise ukukhanya.Inhloso ukuvimba i-vias ukuvimbela ubuhlalu bethayela ekucasheni emigodini, ngoba ubuhlalu be-tin buzogeleza kuma-pads lapho buhlakazeka ekushiseni okuphezulu, okubangela amasekhethi amafushane, ikakhulukazi ku-BGA.Uma i-vias ingenayo i-inki efanele, imiphetho yezimbobo izophenduka ibe bomvu, kubangele ukuthi "ukuvezwa kwethusi okungamanga" kubi.Ngaphezu kwalokho, uma uwoyela wokuxhuma nge-hole ungenziwanga kahle, uzophinde uthinte ukubukeka.

4. Imbobo yepulaki ye-resin

Imbobo yepulaki ye-resin imane isho ukuthi ngemva kokuba udonga lwembobo lumbozwe ngethusi, imbobo edlula ngembobo igcwaliswa nge-epoxy resin, bese ithusi ligqitshwa phezulu.Isisekelo sembobo yepulaki ye-resin ukuthi kufanele kube nokucwetshwa kwethusi emgodini.Lokhu kungenxa yokuthi ukusetshenziswa kwe-resin plug izimbobo kuma-PCB kuvame ukusetshenziselwa izingxenye ze-BGA.I-BGA yosiko ingase isebenzise phakathi kwe-PAD ne-PAD ukuze ihambise izintambo ngemuva.Kodwa-ke, uma i-BGA iminyene kakhulu futhi i-Via ayikwazi ukuphuma, ingabhobhozwa ngokuqondile ku-PAD.Yenza nge-Via kwesinye isitezi ukuze uhambise izintambo.Ingaphezulu lokwenziwa kwe-PCB ye-multilayer ngenqubo ye-resin plug hole ayinabo amazinyo, futhi izimbobo zingavulwa ngaphandle kokuthikameze ukusoda.Ngakho-ke, kuyathandwa kweminye imikhiqizo enezingqimba eziphakeme futhiamabhodi awugqinsi.

5. I-Electroplating nokugcwalisa imbobo

Ukufakwa kwe-Electroplating nokugcwalisa kusho ukuthi i-vias igcwaliswa ngethusi elenziwe ngogesi ngesikhathi sokwenziwa kwe-PCB ye-multilayer, futhi indawo engezansi yomgodi iyisicaba, engahambisani nje nokwakhiwa kwezimbobo ezimboziwe futhi.ngama pads, kodwa futhi kusiza ukuthuthukisa ukusebenza kukagesi, ukuchithwa kokushisa, nokuthembeka.