14 Ungqimba ENIG FR4 Ungcwatshwe Nge-PCB
Mayelana Nezimpumputhe Zingcwatshwe Nge-PCB
I-Vis eyimpumputhe kanye ne-vias engcwatshwe yizindlela ezimbili zokusungula ukuxhumana phakathi kwezingqimba zebhodi lesifunda eliphrintiwe.I-vias eyimpumputhe yebhodi lesifunda ephrintiwe yi-vias ehlanganiswe ngethusi engaxhunywa kungqimba lwangaphandle ngokusebenzisa iningi lesendlalelo sangaphakathi.Umgodi uxhuma izingqimba ezimbili noma ngaphezulu zangaphakathi kodwa awungeni ungqimba olungaphandle.Sebenzisa i-microblind vias ukuze ukhuphule ukuminyana kokusatshalaliswa kolayini, uthuthukise imvamisa yomsakazo kanye nokuphazamiseka kazibuthe kagesi, ukuqhutshwa kokushisa, okufakwe kumaseva, omakhalekhukhwini, amakhamera edijithali.
Wangcwatshwa Nge-PCB
I-Vias engcwatshiwe ixhuma izingqimba ezimbili noma ngaphezulu zangaphakathi kodwa ayingeni ungqimba olungaphandle
| I-Min Hole Diameter/mm | Indandatho encane/mm | nge-pad Diameter/mm | Ubukhulu Ububanzi/mm | I-Aspect ratio | |
| I-Blind Vias(evamile) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| I-Blind Vias(umkhiqizo okhethekile) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Impumputhe Nge-PCB
I-Blind Vias iwukuxhuma ungqimba lwangaphandle okungenani isendlalelo esisodwa sangaphakathi
|
| Okuncane.Imbobo Ububanzi/mm | Iring encane/mm | nge-pad Diameter/mm | Ubukhulu Ububanzi/mm | I-Aspect ratio |
| I-Blind Vias(ukubhola ngomshini) | 0.1 | 0.1 | 0.3 | 0.4 | 1:10 |
| Izimpumputhe Vias(I-Laser drilling) | 0.075 | 0.075 | 0.225 | 0.4 | 1:12 |
Inzuzo ye-Vias eyimpumputhe kanye ne-Vias engcwatshwe onjiniyela ukwanda komthamo wengxenye ngaphandle kokukhuphuka kwenombolo yesendlalelo nosayizi webhodi lesifunda.Ngemikhiqizo ye-elekthronikhi enendawo ewumngcingo kanye nokubekezelelana komklamo omncane, ukwakheka kwembobo eyimpumputhe kuyisinqumo esihle.Ukusetshenziswa kwezimbobo ezinjalo kusiza unjiniyela womklamo wesifunda ukuthi aklame isilinganiso esifanele sembobo/iphedi ukuze agweme izilinganiso ezeqile.
