4 Ungqimba ENIG PCB 8329
Ukukhiqiza ubuchwepheshe be-metallized half hole PCB
Umgodi wensimbi oyinsimbi unqunywa phakathi ngemuva kokumiswa komgodi oyindilinga. Kulula ukuvela kwesimangaliso sezinsalela zocingo zethusi nentsimbi yesikhumba esontwe emgodini oyisigamu, ethinta ukusebenza komgodi wesigamu futhi iholele ekwehleni kokusebenza komkhiqizo nesivuno. Ukuze unqobe ukukhubazeka okungenhla, kuzokwenziwa ngokwenqubo elandelayo yezinyathelo ze-metallized semi-orifice PCB
1. Icubungula ummese wohlobo lwentaba engu-V kabili.
2. Ku-drill yesibili, imbobo yomhlahlandlela iyangezwa onqenqemeni lomgodi, isikhumba sethusi sisuswe ngaphambi kwesikhathi, futhi i-burr iyancipha. Ama-grooves asetshenziselwa ukubhola ukukhulisa ijubane lokuwa.
3. Amapuleti ethusi ku-substrate, ukuze ungqimba lwensimbi yethusi odongeni lomgodi wembobo oyindilinga onqenqemeni lwengcwecwe.
4. Isifunda sangaphandle senziwa ngefilimu yokucinana, ukuvezwa nokuthuthukiswa kwe-substrate ngokulandelana, bese i-substrate ifakwa ngethusi nethini kabili, ukuze ungqimba lwethusi odongeni lomgodi wembobo oyindilinga onqenqemeni lwe-substrate ipuleti liyaqina futhi ungqimba lwethusi lumbozwe ungqimba lukathayela onomphumela wokulwa nokugqwala;
5. Uhhafu wembobo owenza ipuleti onqenqemeni imbobo eyindilinga esikwe phakathi ukwenza umgodi oyingxenye;
6. Ukususa ifilimu kuzosusa ifilimu yokulwa nengcindezelo ngenkathi kucindezelwa ifilimu;
7. Namathisela i-substrate, bese ususa ukuvezwa kwethusi okuveziwe kusendlalelo sangaphandle se-substrate ngemuva kokususa ifilimu;
Ukuxebula amathini I-substrate iyahluzwa ukuze ithini lisuswe odongeni olunamanzi abovu futhi kuvezwe ungqimba lwethusi odongeni olugobekile.
8. Ngemuva kokubumba, sebenzisa itheyipu ebomvu ukunamathisela amapuleti amayunithi ndawonye, nangaphezulu komugqa we-alkaline etching ukususa ama-burrs
9. Ngemuva kokufakwa kwesigaxa sethusi okwesibili nophahla wethini ku-substrate, imbobo eyindilinga onqenqemeni lwengcwecwe isikwa phakathi ukwenza umgodi oyingxenye. Ngoba ungqimba lwethusi lwodonga lomgodi lumbozwe ngothayela wethini, futhi ungqimba lwethusi lodonga lomgodi luxhunyaniswe ngokuphelele nongqimba lwethusi lwengqimba engaphandle ye-substrate, namandla okubopha makhulu, ungqimba lwethusi emgodini udonga lungagwenywa ngempumelelo lapho kusikwa, njengokukhipha noma into yokugoqa ithusi;
10. Ngemuva kokuphothulwa kwe-semi-hole ukwakha bese ususa ifilimu, bese kuthi i-etch, i-copper surface oxidation ngeke yenzeke, igweme ngempumelelo ukwenzeka kwezinsalela zethusi ngisho nesenzakalo sesifunda esifushane, kuthuthukise isivuno se-metallized semi-hole PCB
Isicelo
Ukulawulwa kwezimboni
I-electronics yabathengi
Ukuxhumana
Isisetshenziswa ukubonisa
Okuzenzakalelayo Plating Line
Umugqa we-PTH
I-LDI
Umshini Wokuveza we-CCD
Imboni yethu
