4 Ungqimba ENIG FR4 Half Hole PCB

Ngokusebenzisa indlela yokuhlanganisa imbobo yesitembu, inhloso ukwenza ibha yokuxhuma phakathi kwepuleti elincane nepuleti elincane.Ukuze kube lula ukusika, ezinye izimbobo zizovulwa phezulu kwebha (ububanzi bembobo evamile yi-0.65-0.85 MM), okuyimbobo yesitembu.Manje ibhodi kufanele lidlule umshini we-SMD, ngakho-ke uma wenza i-PCB, ungakwazi ukuxhuma ibhodi i-PCB eminingi kakhulu.ngesikhathi Ngemva kwe-SMD, ibhodi elingemuva kufanele lihlukaniswe, futhi imbobo yesitembu ingenza ibhodi libe lula ukuhlukanisa.Unqenqema lwembobo ewuhhafu alukwazi ukusikwa kwakheka u-V, kwakheka i-gong engenalutho (CNC).

1.V-cutting splicing plate, imbobo uhhafu PCB onqenqemeni musa ukwenza V-ukusika ukwakha (izodonsa ucingo lwethusi, okuholela kungabikho imbobo yethusi)

2. Isethi Yesitembu

I-PCB splicing indlela ngokuyinhloko i-V-CUT, uxhumano lwebhuloho, imbobo yesitembu sokuxhuma kwebhuloho ngalezi zindlela eziningana, usayizi we-splice awukwazi ukuba mkhulu kakhulu, futhi awukwazi ukuba mncane kakhulu, ibhodi ngokuvamile lincane kakhulu lingakwazi ukuhlukanisa ukucutshungulwa kwepuleti noma ukushisela okulula. kodwa hlanganisa i-PCB.

Ukuze kulawulwe ukukhiqizwa kwepuleti lensimbi elinembobo ewuhhafu, ezinye izinyathelo zivame ukuthathwa ukuwela isikhumba sethusi sembobo phakathi kwembobo eyi-metalized half-hole kanye nembobo engeyona eyensimbi ngenxa yezinkinga zobuchwepheshe.I-PCB ene-metalized half-hole ifana ne-PCB ezimbonini ezihlukahlukene.Imbobo eyingxenye yensimbi kulula ukukhipha ithusi embobeni lapho ugaya unqenqema, ngakho-ke izinga le-scrap liphezulu kakhulu.Ngokujika kwangaphakathi kwe-drape, umkhiqizo wokuvimbela kufanele uguqulwe ngenqubo yakamuva ngenxa yekhwalithi.Inqubo yokwenza lolu hlobo lwepuleti iphathwa ngokuvumelana nalezi zinqubo ezilandelayo: ukubhoboza (ukubhoboza, i-gong groove, i-plate plating, i-imaging yangaphandle yokukhanya, i-graphic electroplating, ukomisa, ukwelashwa kwe-half hole, ukukhishwa kwefilimu, ukufakwa, ukukhishwa kwe-tin, ezinye izinqubo; umumo).