4 Layer ENIG RO4003+AD255 Mixed Lamination PCB
I-RO4003C Rogers High Frequency PCB Materials
Impahla ye-RO4003C ingasuswa ngebhulashi lenayiloni elivamile.Akukho ukuphatha okukhethekile okudingekayo ngaphambi kwe-electroplating yethusi ngaphandle kukagesi.Ipuleti kufanele liphathwe kusetshenziswa inqubo evamile ye-epoxy/glass.Ngokuvamile, akudingekile ukususa i-borehole ngoba isistimu ye-TG ephezulu ye-resin (280°C+[536°F]) ayiguquki kalula phakathi nenqubo yokumba.Uma ibala libangelwa ukubhoboza okunolaka, inhlaka ingasuswa kusetshenziswa umjikelezo we-plasma we-CF4/O2 ojwayelekile noma ngenqubo ekabili ye-alkaline permanganate.
I-RO4003C impahla engaphezulu ingase ilungiselelwe ngomshini kanye/noma ngamakhemikhali ukuze kuvikelwe ukukhanya.Kunconywa ukusebenzisa ama-photoresist ajwayelekile ane-aqueous noma ama-semi-aqueous.Noma iyiphi i-copper wiper etholakalayo ethengiswayo ingasetshenziswa.Wonke amamaski angahluzwa noma athengiswe ngesithombe ajwayele ukusetshenziselwa ama-epoxy/glass laminates anamathela kahle kakhulu ebusweni be-ro4003C.Ukuhlanzwa ngemishini kwezindawo eziveziwe ze-dielectric ngaphambi kokufakwa kwezifihla-buso zokushisela kanye nezindawo eziqokiwe “ezibhalisiwe” kuzogwema ukunamathela okufanele.
Izidingo zokupheka zezinto ze-ro4000 zilingana nalezo ze-epoxy/glass.Ngokuvamile, imishini engapheki amapuleti e-epoxy/glass ayidingi ukupheka amapuleti e-ro4003.Ukuze kufakwe ingilazi ye-epoxy/ebhakiwe njengengxenye yenqubo evamile, sincoma ukupheka ku-300°F, 250°f (121°c-149°C) amahora angu-1 ukuya kwangu-2.I-Ro4003C ayiqukethe i-flame retardant.Kungaqondwa ukuthi ipuleti elipakishwe kuyunithi ye-infrared (IR) noma elisebenza ngesivinini esiphansi kakhulu sokudlulisa lingafinyelela amazinga okushisa angaphezu kuka-700°f (371°C);I-Ro4003C ingaqala ukusha kulawa mazinga okushisa aphezulu.Amasistimu asasebenzisa amadivaysi e-infrared reflux noma ezinye izisetshenziswa ezingafinyelela kulawa mazinga okushisa aphezulu kufanele athathe izinyathelo ezidingekayo ukuze aqinisekise ukuthi abukho ubungozi.
Ama-laminates ama-high-frequency angagcinwa unomphela ekamelweni lokushisa (55-85 ° F, 13-30 ° C), umswakama.Ezingeni lokushisa lasekamelweni, izinto ze-dielectric zinert kumswakama ophezulu.Kodwa-ke, izindwangu zensimbi ezifana nethusi zingakhipha i-oxidize lapho zivezwa kumswakama ophezulu.Ukuhlanzwa kwangaphambili okujwayelekile kwe-PCBS kungasusa kalula ukugqwala ezintweni ezigcinwe kahle.
Izinto ze-RO4003C zingenziwa ngomshini kusetshenziswa amathuluzi ngokuvamile asetshenziselwa i-epoxy/ingilazi nezimo zensimbi eqinile.I-foil yethusi kufanele ikhishwe esiteshini somhlahlandlela ukuvimbela ukugcoba.
Amapharamitha we-Rogers RO4350B/RO4003C
| Izakhiwo | I-RO4003C | I-RO4350B | Isiqondiso | Iyunithi | Isimo | Indlela Yokuhlola |
| UDkt(ε) | 3.38±0.05 | 3.48±0.05 | - | 10GHz/23℃ | IPC.TM.6502.5.5.5Ukuhlolwa komugqa we-Clamp microstrip | |
| UDkt(ε) | 3.55 | 3.66 | Z | - | 8 kuye ku-40 GHz | Indlela yobude besigaba esihlukile |
| Isici sokulahlekelwa(tan δ) | 0.00270.0021 | 0.00370.0031 | - | 10GHz/23℃2.5GHz/23℃ | IPC.TM.6502.5.5.5 | |
| I-coefficient yezinga lokushisai-dielectric njalo | +40 | +50 | Z | ppm/℃ | 50 ℃ kuya ku-150 ℃ | IPC.TM.6502.5.5.5 |
| Ukumelana Nomthamo | 1.7X100 | 1.2X1010 | MΩ.cm | COND A | IPC.TM.6502.5.17.1 | |
| Ukumelana Nobuso | 4.2X100 | 5.7X109 | MΩ | 0.51mm(0.0200) | IPC.TM.6502.5.17.1 | |
| Ukukhuthazela Kagesi | 31.2(780) | 31.2(780) | Z | KV/mm(V/mil) | I-RT | IPC.TM.6502.5.6.2 |
| I-Tensile Modulus | 19650 (2850)19450 (2821) | 16767 (2432)14153 (2053) | XY | I-MPa(kpsi) | I-RT | I-ASTM D638 |
| Amandla Okuqina | 139(20.2)100 (14.5) | 203 (29.5)130 (18.9) | XY | I-MPa(kpsi) | I-ASTM D638 | |
| Ukugoba Amandla | 276(40) | 255(37) | I-MPa(kpsi) | IPC.TM.6502.4.4 | ||
| Ukuzinza kweDimensional | ＜0.3 | ＜0.5 | X,Y | mm/m(mils/intshi) | Ngemuva kokuhlinzwa+E2/150℃ | IPC.TM.6502.4.39A |
| I-CTE | 111446 | 101232 | XYZ | ppm/℃ | 55 ukuze 288℃ | IPC.TM.6502.4.41 |
| Tg | ＞280 | ＞280 | ℃ DSC | A | IPC.TM.6502.4.24 | |
| Td | 425 | 390 | ℃ TGA | I-ASTM D3850 | ||
| I-Thermal Conductivity | 0.71 | 0.69 | W/m/K | 80℃ | I-ASTM C518 | |
| Izinga Lokumunca Umswakama | 0.06 | 0.06 | % | Amasampula angu-0.060" acwiliswe emanzini angu-50°C amahora angu-48 | I-ASTM D570 | |
| Ukuminyana | 1.79 | 1.86 | gm/cm3 | 23℃ | I-ASTM D792 | |
| Amandla e-Peel | 1.05(6.0) | 0.88(5.0) | N/mm(pli) | 1 oz.I-EDC ngemuva kokukhishwa kwe-tin | IPC.TM.6502.4.8 | |
| I-Flame Retadancy | N/A | V0 | UL94 | |||
| I-Lf Treatment Iyahambisana | Yebo | Yebo |
Ukusetshenziswa kwe-RO4003C High Frequency PCB
Imikhiqizo yokuxhumana yeselula
I-Power Splitter, i-coupler, i-duplexer, isihlungi namanye amadivaysi angenzi lutho
Isihlelamandla samandla, Isihlelamsindo esiphansi, njll
Uhlelo lokulwa nokushayisana kwezimoto, uhlelo lwesathelayithi, uhlelo lomsakazo neminye imikhakha
Isibonisi Sezisetshenziswa
PCB Automatic Plating Line
Umugqa we-PCB PTH
I-PCB LDI
