I-8 Layer ENIG FR4 Multilayer PCB

1. Ubunzima bokuqondanisa kwe-interlayer

Ngenxa yezingqimba eziningi zebhodi le-PCB lezendlalelo eziningi, imfuneko yokulinganisa yesendlalelo se-PCB iphezulu nangaphezulu.Ngokuvamile, ukubekezelelana kokuqondanisa phakathi kwezingqimba kulawulwa ku-75um.Kunzima kakhulu ukulawula ukuhleleka kwebhodi le-PCB ye-multilayer ngenxa yobukhulu beyunithi, izinga lokushisa eliphezulu kanye nomswakama endaweni yokusebenzela yokuguqulwa kwezithombe, ukugqagqana kokuhlukana okubangelwa ukungahambisani kwamabhodi ayisisekelo ahlukene, kanye nemodi yokumisa phakathi kwezingqimba. .

2. Ubunzima bokukhiqizwa kwesifunda sangaphakathi

Ibhodi le-PCB ye-multilayer yamukela izinto ezikhethekile ezifana ne-TG ephezulu, isivinini esikhulu, imvamisa ephezulu, ithusi elisindayo, ungqimba oluncane lwe-dielectric nokunye, okubeka phambili izidingo eziphakeme zokukhiqiza isifunda sangaphakathi nokulawula usayizi wesithombe.Isibonelo, ubuqotho bokudluliselwa kwesignali ye-impedance kwandisa ubunzima bokwenziwa kwesifunda sangaphakathi.Ububanzi nezikhala zemigqa zincane, isifunda esivulekile kanye nesifunda esifushane siyakhula, izinga lokuphasa liphansi;ngezingqimba zesignali yomugqa omncane omningi, amathuba okuthola ukuvuza kwe-AOI ayanda.I-inner core plate incane, ishwabene kalula, ingabonakali kahle, kulula ukuyigoqa;I-multilayer PCB iyibhodi lesistimu, elinosayizi weyunithi omkhulu kanye nezindleko eziphakeme ze-scrap.

3. Ubunzima ekukhiqizeni i-lamination kanye nokufaka

Amabhodi amaningi angaphakathi angaphakathi namabhodi aphethwe kancane abekwe phezulu, athambekele ekubeni nama-slide plate, i-lamination, i-resin void kanye nezinsalela zebhamuza ekukhiqizeni isitembu.Ekwakhiweni kwesakhiwo se-laminated, ukumelana nokushisa, ukumelana nokucindezela, okuqukethwe kweglue kanye nokuqina kwe-dielectric yezinto ezibonakalayo kufanele kucatshangelwe ngokugcwele, futhi kufanele kwenziwe uhlelo lokucindezela olufanele lwe-multilayer plate.Ngenxa yenani elikhulu lezendlalelo, ukulawulwa kokunwetshwa nokuncipha kanye nesinxephezelo se-coefficient yesayizi asihambisani, futhi ungqimba oluncane lwe-inter-layer insulating kulula ukuholela ekuhlulekeni kokuhlolwa kokuthembeka kwe-inter-layer.

4. Izinkinga zokukhiqiza zokumba

Ukusetshenziswa kwe-TG ephezulu, isivinini esikhulu, imvamisa ephezulu, ipuleti eliyisipesheli lethusi eliwugqinsi kwandisa ubulukhuni bokubhola, i-drilling burr kanye nobunzima bokukhipha amabala.Izendlalelo eziningi, amathuluzi okumba kulula ukuwaphula;Ukwehluleka kwe-CAF okubangelwa i-BGA eminyene kanye nesikhala sodonga lwembobo ewumngcingo kulula ukuholela enkingeni yokumba ethambekele ngenxa yokuqina kwe-PCB.