8 Isendlalelo se-HASL Multilayer FR4 PCB
Kungani Amabhodi e-Multilayer PCB Evame Ukusho?
Ngenxa yokuntuleka kongqimba lwe-medium ne-foil, izindleko zezinto zokusetshenziswa ze-PCB eziyinqaba ziphansi kancane kunalezo ze-PCB.Kodwa-ke, izindleko zokucubungula ze-PCB yesendlalelo esingajwayelekile ziphezulu kakhulu kunalezo ze-PCB yongqimba.Izindleko zokucubungula zesendlalelo sangaphakathi ziyafana, kodwa isakhiwo se-foil/core sinyusa kakhulu izindleko zokucubungula zesendlalelo sangaphandle.
I-PCB yesendlalelo esingajwayelekile idinga ukungeza inqubo yokubopha ungqimba olungajwayelekile lwe-lamination core ngesisekelo senqubo yesakhiwo esiwumongo.Uma kuqhathaniswa nesakhiwo senuzi, ukusebenza kahle kokukhiqiza kwesikhungo esinocwecwe lwe-foil ngaphandle kwesakhiwo senuzi kuzoncishiswa.Ngaphambi kwe-lamination, i-core yangaphandle idinga ukucutshungulwa okwengeziwe, okwandisa ubungozi bokuklwebheka kanye namaphutha okufaka ungqimba lwangaphandle.
Izinhlobonhlobo Zezinqubo ze-PCB
I-Rigid-Flex PCB
Iguquguquka futhi izacile, yenza inqubo yokuhlanganisa umkhiqizo ibe lula
Yehlisa izixhumi, umthamo wokuthwala ulayini ophezulu
Isetshenziswa ohlelweni lwezithombe kanye nemishini yokuxhumana ye-RF
I-Multilayer PCB
Ubuncane bobubanzi bomugqa nesikhala somugqa 3/3mil
I-BGA 0.4pitch, imbobo encane engu-0.1mm
Isetshenziswa ekulawuleni izimboni kanye umthengi electronics
I-Impedans Control PCB
Lawula ngokuqinile ububanzi bomqhubi / ukujiya kanye nobukhulu obuphakathi
Ukubekezelela kobubanzi bomugqa wokuvinjelwa ≤± 5%, ukufanisa okuhle kokuvimbela
Kusetshenziswa kumadivayisi anemvamisa ephezulu kanye nesivinini esikhulu kanye nemishini yokuxhumana engu-5g
I-PCB ye-Half Hole
Ayikho iva lethusi elisele noma elijikayo emgodini ophakathi
Ibhodi lezingane lebhodi lomama ligcina izixhumi nesikhala
Kufakwe kumojuli ye-Bluetooth, isamukeli sesignali
