I-8 Layer ENIG Impedance Control Heavy Copper PCB
I-Thin Core Heavy Copper PCB Ukukhetha kweFoil yethusi
Inkinga ethintekayo kakhulu yethusi elisindayo le-CCL PCB yinkinga yokumelana nokucindezela, ikakhulukazi umgogodla omncane osindayo we-PCB yethusi (umgogodla omncane uwugqinsi oluphakathi ≤ 0.3mm), inkinga yokumelana nokucindezela ivelele kakhulu, i-PCB eqinile yethusi eqinile izokhetha i-RTF. ucwecwe lwethusi lokukhiqiza, icwecwe le-RTF lethusi kanye ne-STD yethusi umehluko omkhulu ubude boboya be-Ra buhlukile, i-RTF ucwecwe lwethusi i-Ra incane kakhulu kune-STD yefoyili yethusi.
Ukucushwa koboya be-foil yethusi kuthinta ukushuba kongqimba lwe-substrate insulation.Ngokucaciswa okufanayo kogqinsi, i-RTF ye-copper foil Ra incane, futhi ungqimba olusebenzayo lokufakwa kwe-dielectric layer ngokusobala lushubile.Ngokunciphisa i-wool coarsening degree, ukumelana nokucindezela kwethusi elisindayo le-substrate encane kungathuthukiswa ngempumelelo.
Heavy Copper PCB CCL Futhi Prepreg
Ukuthuthukiswa nokukhuthazwa kwezinto ze-HTC: ithusi aligcini nje ngokusebenza kahle kanye ne-conductivity, kodwa futhi ine-conductivity enhle yokushisa.Ukusetshenziswa kwe-PCB yethusi esindayo kanye nokusetshenziswa kwe-HTC medium kancane kancane kuba isiqondiso sabaklami abaningi ukuxazulula inkinga yokukhishwa kokushisa.Ukusetshenziswa kwe-HTC PCB enomklamo we-foil yethusi esindayo kulungele kakhulu ukushabalaliswa kokushisa okuphelele kwezingxenye ze-elekthronikhi, futhi kunezinzuzo ezisobala ngezindleko nenqubo.